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The relationship between the development prospect of copper plastic composite belt and its technical superiority
Apr 27, 2018

When it comes to the relationship between the prospects for the development of the copper plastic composite belt and the technical advantages, it is necessary to pay attention to the rolling process of the copper plastic composite belt and the thinning of the thickness in the qualitative leap. The fundamental difference in the copper belt is on its thickness.

 

In China, the division of copper plastic composite belt and copper belt is divided by 0.05mm boundary. The United States, Japan and other countries are divided by 0.1mm, and the import and export of Chinese customs is divided by 0.15mm. At this time, the current status of the domestic copper plastic composite belt production technology is relatively backward abroad, and the copper plastic composite belt is rolled at present. It is still the main form of rolling pressure reduction to complete the rolling process, which is its technical characteristics, and is also a matter for attention when it develops.

 

The prospects for the development of the copper plastic composite belt and the surface treatment technology in the post process of the production process should also be paid attention to. In this case, the surface passivation treatment for the later use of the copper plastic composite belt, and the requirements for the binding capacity of the calendering copper plastic composite belt with the printed circuit board, are required. It has certain chemical resistance, heat resistance and ion mobility.

 

The development prospect of the copper plastic composite belt is accompanied by the continuous development of electronic products to miniaturization and multi-function. In this respect, the printed board will inevitably promote the development of multilayer, high integration and high density. Therefore, the thin products required in the fine lines have higher anti peeling strength. Requirements, and can effectively reduce or avoid etching line generated "side corrosion" phenomenon.

 

In the high frequency circuit, the copper plastic composite belt is required to have better ion transfer resistance and prevent circuit short circuit or circuit breakage caused by the loss of the resin substrate insulation due to ion migration. Furthermore, the relationship between the development prospect of the copper plastic composite belt and this technology should be paid attention to the heat resistance ratio of the copper plastic composite belt. The original is much higher, and the quality is undeniable.http://www.copolymercoatedaluminumtape.com/








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